STABILIZERS OF SOLUTIONS OF CHEMICAL COPPER PLATING
Abstract
The work is devoted to the study of the effect of various compounds on the stability of electroless copper plating solution containing Trilon B. as a chelating agent. The stability of electroless copper plating solutions was estimated by the accelerated method as the time before the start of intensive decomposition of the solution after the introduction of 0.15 ml of colloidal palladium activator solution heated to 75 °C in 250 ml. As stabilizers, both known, currently used, and newly selected compounds were investigated. Sulfur- and/or nitrogen-containing organic and inorganic compounds such as: sodium diethyldithiocarbamate, 2,2’–dipyridyl, thiosemicarbazide, potassium hexacyanoferrate (III), potassium hexacyanoferrate (II), thiourea, thioglycolic acid, dimethylglyoxime, potassium rhodanide in concentrations in the range of 1 - 50 μmol/l were among the first studied. It is shown that when the stabilizers are contained in the solution at the optimal concentrations set (for each compound), solutions containing sodium diethyldithiocarbamate, thioglycolic acid, thiosemicarbazide, thiourea (in descending order of stabilizing action), i.e. compounds containing a sulfur-carbon bond, have the greatest stability. With this in mind, other sulfur-containing compounds, including heterocyclic ones, were selected and studied as stabilizers: α-lipoic acid, thiamine chloride, methyl orange, nitroso-p-salt, methylene blue and SPADNS (sodium salt of 2-(psulfophenylazo)-1,8- dihydroxynaphthalene-3,6- disulfonic acids). In addition, nitrogen-containing compounds that were not previously used in electroless copper plating solutions as stabilizers were also studied: nicotine, pyridoxine, Janus Green B (8-(4-dimethylaminophenyl) diazenyl-N, N-diethyl-10-phenylphenazine-10-ium-2-amine chloride), nigrosine, however. Solutions of electroless copper plating in the presence of these compounds did not show high stability. It has been established that the most effective, comparable in effect to the stabilizers currently used, are α-lipoic acid and thiamine chloride. The advantages of the latter are their availability and low toxicity.
For citation:
Solopchuk M.S., Grigoryan N.S., Asnis N.A., Vagramyan T.A., Shmelkova P.O., Bardina O.I. Stabilizers of solutions of chemical copper plating. ChemChemTech [Izv. Vyssh. Uchebn. Zaved. Khim. Khim. Tekhnol.]. 2023. V. 66. N 3. P. 100-107. DOI: 10.6060/ivkkt.20236603.6708.
References
Sha W., Wu X., Keong K.G. Electroless Copper and Nickel–Phosphorus Plating: Processing, Characterisation and Modelling. Woodhead Publ. 2011. 301 p. DOI: 10.1533/9780857090966.
Swatilekha G. Electroless copper deposition: A critical review. Thin Solid Films. 2019. V. 669. P. 641–658. DOI: 10.1016/j.tsf.2018.11.016.
Sharma A., Cheon C.-S., Jung J.P. Recent Progress in Electroless Plating of Copper. J. Microelectr. Packag. Soc. 2016. V. 23. N 4. P. 1-4. DOI: 10.6117/kmeps.2016.23.4.001.
Hashmi S. Comprehensive Materials Processing. Elsevier Science Ltd. 2014. 5474 p.
Jothilakshmia S., Manikanda Kumarana T., Rekha S. Studies of role of additives on electroless copper methane sulphonate an ecofriendly green bath. J. Indian Chem. Soc. 2020. V. 97. N 9b. P. 1514-1522.
Chernyshyov A. Accuracy classes of printed circuit boards and modern technologies. Pechatnyi Montazh. 2009. N 6. P. 18-21 (in Russian).
GOST 23770-79 Printed circuit boards. Standart processes of chemical and galvanic metallization. М.: Izd-vo standartov. 1995. 35 p. (in Russian).
Balaramesh P., Venkatesh P., Rekha S., Hemamalini M. Bath Parameters Affecting Electroless Copper Deposition - A Review. Int. J. Innovat. Res.Stud. 2014. V. 3. N 4. P. 168-181. DOI: 10.13140/RG.2.2.29085.33763.
Schlesinger M., Paunovic M. Modern electroplating. Wiley. 2010. 737 p. DOI: 10.1002/9780470602638.
Shalkauskas M., Vashkialis A. Chemical metallization of plastics. L.: Chemistry. 1985. 144 p. (in Russian).
Shkundina S. New processes and materials in the production of printed circuit boards. Tekhnol. Elektr. Prom-sti. 2009. N 4. P. 16-20 (in Russian).
Farid Hanna, Abdel Hamid Z., Abdel Aal A. Controlling factors affecting the stability and rate of electroless copper plating. Mater. Lett. 2003. V. 58. P. 104-109. DOI: 10.1016/S0167-577X(03)00424-5.
Jianhong L., Mingyong W., Xiaomei D., Jianhei Y., Jimmy Y., Shuqiang J. Evaluation of K3Fe(CN)6 on Deposition Behavior and Structure of Electroless Copper Plating. Electrochemistry. 2019. V. 87. N 4. P. 214-219. DOI: 10.5796/electrochemistry.19-00010.
Cobley A.J., Comeskey D.J., Paniwnyk L., Mason T.J. Through hole plating of printed circuit boards using ultra-sonically dispersed copper nanoparticles. Circuit World. 2010. V. 36. N 3. P. 9-13. DOI: 10.1108/03056121011066288.
Shestakov K.V., Lazarev S.I., Polyanskiy K.K. Study of kinetic and structural characteristics of membranes in purification process of copper-containing solutions by electrodialysis. ChemChemTech [Izv. Vyssh. Uchebn. Zaved. Khim. Khim. Tekhnol.]. 2019. V. 62. N 7. P. 65-71 (in Russian). DOI: 10.6060/ivkkt.20196207.5827.
Mileshko L. Prospects for environmental friendliness increasing of the production of electronic equipment. Tekhnol. Tekhnosfer. Bezopasn. 2016. N 2 (66). P. 245-252. (in Russian).
Balaramesh P., Jayalakshmi S., Absara Fdo S., Anitha V., Venkatesh P. Thin film to nano copper deposition by special additives on an ecofriendly electroless bath. Mater. Today: Proc. 2021. V. 47. P. 1862–1867. DOI: 10.1016/j.matpr.2021.03.513.
Balaramesh P., Jayalakshmi S., Absara Fdo S., Anitha V., Venkatesh P. Influence of organosulphur additives on autocatalytic copper thin film deposition. Mater. Today: Proc. 2021. V. 47. P. 2020-2024. DOI: 10.1016/j.matpr.2021.04.212.
Jayalakshmi S., Venkatesh P., BalaRamesh P. Recent Advances in Electroless Copper Deposition – A Review. Int. J. Adv. Res. Eng. Appl. Sci. 2016. V. 5. N 8. P. 1-18.
Absara Fdo S., Venkatesh P., Balaramesh P. Studies on Plating Bath Requirements in Electroless Copper Deposi-tion - A Review. Int. J. Analyt. Exper. Modal Anal. 2020. V. 12. N 6. P. 137-148.
Anitha V., Venkatesh P., Balaramesh P. Studies on the Influence of Electroless Copper Deposition Process – A Review. Int. J. Res. Appl. Sci. Eng. Technol. 2018. V. 6. N 8. P. 629-635.
Wang X., Li N., Yang Z., Wang Z. Effects of Triethanolamine and K4[Fe(CN)6] upon Electroless Copper Plating. J. Electrochem. Soc. 2010. V. 157. N 9. P. 500-502. DOI: 10.1149/1.3462980.
Martins J.I., Nunes M.C., Tavares P.B. Copper electroless plating in presence of cobalt ions using hypophos-phite as reductant. Corros. Prot. Mater. 2016. V. 35. N 1. P. 6-14.
